Plasma MBE growth conditions of AlGaN/GaN high-electron-mobility transistors on silicon and their device characteristics with epitaxially regrown ohmic contacts

نویسندگان

  • Satyaki Ganguly
  • Jai Verma
  • Huili Grace
  • Debdeep Jena
چکیده

Silicon substrates offer an attractive substrate platform for GaN RF and power electronics. In this work, we address the key challenges and provide solutions for the RF-MBE growth of GaN high-electron-mobility transistors (HEMTs) on Si(111). Moreover, by developing low-leakage buffer layers and employing raised source/drain regrown ohmic contacts, high-performance HEMTs are realized at a significantly lower process temperature by plasma MBE than by MOCVD. This is expected to motivate further ideas for the integration of GaN with silicon that go beyond RF and power electronics into the regime of low-power digital logic by exploiting the unique polarization properties of GaN. © 2014 The Japan Society of Applied Physics

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

AlGaN/GaN HEMTs on Si by MBE with regrown contacts and fT = 153 GHz

AlGaN/GaN high-electron-mobility transistors (HEMT) have been grown by radio frequency molecular beam epitaxy (RF-MBE) on 3” Si substrates. A record low contact resistance Rc ~ 0.11 .mm has been achieved for GaN HEMTs on Si by using non alloyed ohmic contacts regrown by MBE. Owing to the low contact resistance a 75-nm gate length unpassivated HEMT shows intrinsic current gain cut-off frequency ...

متن کامل

Analysis of AlGaN/GaN high electron mobility transistors with nonalloyed Ohmic contacts achieved by selective area growth using plasma assisted molecular beam epitaxy

We achieved low-resistance nonalloyed Ohmic contacts for n-type GaN using selective area growth (SAG) by plasma assisted molecular beam epitaxy (PAMBE). Thus-fabricated high electron mobility transistor (HEMT) demonstrated comparable or more favorable electrical performance than the conventional alloyed counterpart. Meanwhile, the nonalloyed PAMBE-SAG technique avoids problems created by the hi...

متن کامل

Metal-face InAlN/AlN/GaN high electron mobility transistors with regrown ohmic contacts by molecular beam epitaxy

Ohmic regrowth by molecular beam epitaxy (MBE) has been investigated for metal-face InAlN/AlN/GaN high electron mobility transistors (HEMTs) for the first time. Using SiO2 mask nþ-GaN was regrown in the source/drain region while deposition on the mask was lifted off in buffered HF after regrowth. The lowest contact resistance measured was 0.40 0.23Vmm by the transmission line method (TLM) in th...

متن کامل

Effects of hydrostatic pressure and temperature on the AlGaN/GaN High electron mobility transistors

In this paper, drain-source current, transconductance and cutoff frequency in AlGaN/GaN high electron mobility transistors have been investigated. In order to obtain parameters of exact AlGaN/GaN high electron mobility transistors such as electron density, the wave function, band gap, polarization charge, effective mass and dielectric constant, the hydrostatic pressure and temperature effects a...

متن کامل

Leakage mechanisms and contact technologies in InAlN/GaN high electron mobility transistors

GaN based electronic devices have progressed rapidly over the past decades and are nowadays starting to replace Si and classical III-V semiconductors in power electronics systems and high power RF amplifiers. AlGaN/GaN heterostructures have been, until recently, the materials system of choice for nitride based electronics. The limits of AlGaN/GaN technologies are now known and alternative route...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2014